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3S Technology Co., Ltd.
[Korea]
Address:
301-1103 Bucheon Techno Park, 365 Samjeong-dong, Bucheon-si, Gyeonggi-do 421-741 Korea
Phone:
82-32-6211080
Contact name:
Byoung-keon Son , Assistant Manager
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3S Technology Co., Ltd.
 
3D Mobile Sound Processor with stereo audio amplifier

3D Mobile Sound Processor with stereo audio amplifier

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3D Mobile Sound Processor with stereo audio amplifier

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 Model Number 3S-MS210M

Features

The 3S-MS210M is a 3D enhancement device with stereo power amplifiers for mobile applications.
This device has two built-in speaker amplifiers and a 3D sound processor using 3S Around Sound technique. It can be applied to any sound source such the established bell contents (16-, 40-, 64-poly), stereo midi, MP3 and any other audio content. The 3D sound processor supports two kinds of mode: narrow space speakers (NS mode) and wide space speakers (WS mode). For generating 3D sound, 3S-MS210M has no additional processing hardware device or software algorithm. Furthermore, 3S-MS210M can be placed between an audio source generator and speakers with just a minor change of application board and can be adopted to any portable devices currently on the market.

3S-MS210M's dual bridge-connected audio power amplifiers will drive over 500mW to an 8W load with less than 1.0% THD+N under 4.2V battery voltage. In addition, the headphone mode control allows the amplifiers to operate in single-ended mode, which can be used to drive stereo headphones.

3S-MS210M is specifically designed to provide high quality output with high power even with such a small package of 4x4mm2 MLF(QFN) while requiring minimal external components. It also includes a mode control switch for surround function and a shutdown mode to maximize power saving.

3S-MS210M is suitable for cellular phones, PDA, portable PCs, portable games and any mobile devices that need stereo audio and 3D surround effect.

Specifications

  • Operating voltage 2.5 to 5.0V
  • Built in stereo power amplifier
  • Output power 520mW x 2CH
  • No additional processing for 3D surround effect
  • Headphone function
  • Internal mode control switch
  • CMOS technology
  • Package outline

Related Keywords: virtual surround , 3D sound , audio , DSP , portable system


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